MosChip and EMASS Collaborate on Edge AI SoC Silicon Implementation
Filing Summary
MosChip Technologies has announced a collaboration with EMASS for the silicon implementation of EMASS’s ECS-DoT Edge AI System-on-Chip (SoC). The ECS-DoT is designed for ultra-low-power applications in wearables, drones, and industrial IoT. MosChip provided engineering services for the silicon implementation using 22nm technology, contributing to physical design flows and validation activities. This collaboration supports EMASS’s goal of achieving significant performance and energy efficiency improvements. The press release was submitted under Regulation 30 of the SEBI (Listing Obligations and Disclosure Requirements) Regulations 2015.
MosChip Technologies has announced its collaboration with EMASS on the silicon implementation of the ECS-DoT Edge AI System-on-Chip (SoC). This collaboration is focused on supporting EMASS’s ultra-low-power chip designed for applications such as wearables, drones, industrial IoT, and edge sensors. The announcement was made in accordance with Regulation 30 of the Securities and Exchange Board of India (Listing Obligations and Disclosure Requirements) Regulations 2015.
The financial terms of the collaboration between MosChip and EMASS have not been disclosed in the filing. The focus of the collaboration is on the technical and engineering support provided by MosChip for the silicon implementation of the ECS-DoT SoC. This includes contributions to physical design flows, tape-out coordination, packaging, assembly, evaluation hardware, and validation activities.
The scope of work for MosChip involves providing engineering services for the silicon implementation using 22nm technology. The ECS-DoT SoC is a RISC-V-based chip that integrates dual neural accelerators and 4MB of on-chip memory. It is designed to enable real-time, milliwatt-class inference for vision, audio, and sensor workloads without cloud dependency. The collaboration aims to deliver a fully functional SoC and evaluation platform optimized for power- and space-constrained applications.
The ECS-DoT SoC targets significant improvements in performance and energy efficiency, with EMASS setting ambitious targets for up to 93% faster processing and 90% lower energy use compared to conventional edge AI solutions. The collaboration with MosChip is intended to support these objectives by leveraging MosChip’s expertise in silicon and product engineering.
The timeline for the collaboration and specific milestones have not been detailed in the filing. However, the announcement indicates that the collaboration has enabled the development of a fully functional SoC and evaluation platform. The filing was submitted on December 4, 2025, and the press release is available on MosChip’s website.
EMASS, a subsidiary of Nanoveu Ltd, specializes in ultra-low-power AI system-on-chip solutions for edge computing. The company’s flagship ECS-DoT chip delivers high-performance AI processing for vision, audio, and sensor data directly on-device, maximizing energy efficiency through its RISC-V architecture and non-volatile memory technologies.
MosChip Technologies is a leading silicon and product engineering company with 26 years of expertise in silicon design, embedded systems, digital engineering, and AI. The company partners with global semiconductor companies and OEMs to design, engineer, and deliver next-generation solutions across industries. For more information, visit www.moschip.com.