Izmo Microsystems Develops Advanced 3D SiP Module for Space Electronics
Filing Summary
Izmo Ltd’s division, izmo Microsystems, has designed a high-complexity 3D System-in-Package (SiP) module for space payload camera electronics, achieving an 84% reduction in footprint. The module integrates active components using high-density wire bonding and is enclosed in a custom hermetic ceramic package. This development supports India’s semiconductor mission and reduces reliance on foreign technologies. The module is engineered for space-grade reliability, addressing the needs of the global semiconductor market valued at over $20 billion. The achievement aligns with the “Make in India” initiative and positions izmo Microsystems within the advanced semiconductor landscape.
Izmo Ltd, through its specialized division izmo Microsystems, has announced the successful design of a high-complexity 3D System-in-Package (SiP) module for space payload camera electronics. The module achieves an 84% reduction in footprint by transforming traditional 200 mm × 200 mm PCB-based electronics into a compact 81 mm × 81 mm SiP module. This development utilizes advanced 3D SiP architecture with stacked substrates to meet the reliability standards required for space-grade electronics.
The financial terms related to this development have not been disclosed in the filing. However, the achievement is significant for izmo Microsystems as it positions the company within the global semiconductor market, which is valued at over $20 billion. The broader System-in-Package market and space electronics sector are valued at over $10 billion, indicating substantial market opportunities for the company.
The 3D SiP module integrates active components in bare-die form onto a stacked-substrate configuration using high-density wire bonding. This approach allows for high routing density and multi-function integration while maintaining compact dimensions necessary for space-constrained environments. The module is enclosed in a fully indigenized custom hermetic ceramic package, designed and fabricated in India, engineered for environmental robustness and long-term performance in extreme thermal and vacuum conditions of space.
This development represents a major advancement in India’s semiconductor mission and aligns with the “Make in India” initiative. The capability to develop 3D vertical stacking and hermetically sealed ceramic packages indigenously reduces reliance on restricted foreign technologies for mission-critical applications. The achievement establishes a sovereign technical foundation in India for future advancements in Silicon Photonics and Quantum Communications, where traditional packaging methods are insufficient.
The timeline for the implementation of this module has not been specified in the filing. However, the development marks a significant milestone for izmo Microsystems, as it confirms their end-to-end competency in space-grade miniaturization. The company’s focus on building high-value intellectual property within India is evident through this achievement.
izmo Microsystems, a division of izmo Ltd, specializes in advanced IC packaging and silicon photonics solutions. The company provides design and manufacturing services for the aerospace, defense, and electronics sectors and is the exclusive industry partner of the Centre of Excellence for Programmable Silicon Photonics ICs at IIT Madras.
Izmo Ltd focuses on developing advanced semiconductor solutions and is committed to supporting India’s semiconductor mission. The company’s strategic priorities include reducing reliance on foreign technologies and advancing the “Make in India” initiative through innovative developments in the semiconductor industry.